Munich’s QuantumDiamonds GmbH installed their QD m.1 system at Eurofins EAG Laboratories in Sunnyvale, California, marking a major change in the North American semiconductor industry. This deployment marks the company’s first formal US presence and a “defining moment” for manufacturing efficiency in the advanced semiconductor ecosystem.
A Quantum Leap in Failure Analysis
The semiconductor industry faces a critical “yield crisis.” Modern architectures, such as 2.5D and 3D packaging and high-density interconnects, make defect detection harder as chip designs stretch physics. Traditional failure analysis approaches are typically too slow or damaging for modern manufacturing.
The QD m.1 is the first commercially available integrated quantum sensing system for semiconductor testing. The method, which makes use of unique Quantum Diamonds Microscopy (QDM) technology, enables engineers to look into a chip in ways that were previously unattainable without harming the sample.
“Chip fabs are pushing the boundaries of what is physically possible in chip design,” said QuantumDiamonds’ CTO and co-founder Fleming Bruckmaier. “Our job is to give them the tools to understand what is happening inside those devices when things go wrong” . According to Bruckmaier, the QD m.1 offers a radically new way to analyze sophisticated packaging in three dimensions at a speed that is compatible with the demanding operations of the industry.
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Addressing the AI-Driven Chip Shortage
This US expansion’s timing is crucial. The worldwide supply chain is under tremendous strain due to the rapidly increasing demand for Artificial Intelligence (AI), especially with regard to memory chips. In the past, low yields in the production of these cutting-edge components have raised manufacturing costs, postponed sales, and eventually hampered the rate of innovation in the IT industry.
The QD m.1 provides a way to increase manufacturing yields by facilitating non-destructive failure analysis. The technology recognizes electrical faults, particularly “opens,” which are recognized as the leading yield-killing failure mode in the industry, and displays them as clear visual indicators. Manufacturers can improve workflow engineering and more efficiently remove faulty chips with this feature.
The method significantly shortens the failure analysis cycle, which is perhaps most significant for high-volume manufacturers. The damaging, layer-by-layer sample preparation that used to take hours can now be completed in minutes.
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Strategic Partnership in Silicon Valley
It was quite strategic to choose Eurofins EAG Laboratories as the first US location. Located in the center of Silicon Valley, Eurofins EAG is a world leader in failure analysis and materials characterisation, serving thousands of customers in more than 20 locations across the globe.
The significance of this partnership was underlined by QuantumDiamonds CEO and co-founder Kevin Berghoff “Eurofins EAG Laboratories is exactly the right partner to introduce quantum sensing to the North American semiconductor market.” Their collaboration serves as a signal to the whole US semiconductor industry that quantum sensing is real, functional, and prepared to take on the most difficult problems in the industry.
The installation is the result of the two organizations’ long-standing and fruitful cooperation. The QD m.1 expands Eurofins EAG’s capabilities to support clients operating at the most sophisticated technology nodes and intricate topologies, such as wide bandgap devices and backside power supply networks.
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Global Momentum and the Path Ahead
Since its founding in 2022, QuantumDiamonds has quickly grown to become a reputable company in the sector. Although the Sunnyvale installation is a significant US milestone, the business is already well-established in the international market. Nine of the top ten chipmakers in the world are currently working with QuantumDiamonds.
The business is in high demand throughout the global ecosystem outside of the US. The most cutting-edge chip production hubs in Asia are currently engaged in active validation engagements, thus establishing QD m.1 as a new benchmark for top failure analysis labs.
The ability to map current channels in three dimensions without damaging the chip will probably become a need rather than a luxury as the industry advances toward progressively more complicated 3D architectures. For the time being, the implementation at Eurofins EAG is a shining example for the US semiconductor sector, demonstrating that quantum-level precision is now a practical tool for the factory floor rather than a theoretical idea.
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